Our facilities are as follows:-
* Infra red reflow (Single and double sided)
* Ultra thin foil stencil solder paste printing
* Specialist fine pitch assembly equipment
* Specialist BGA assembly equipment
* Environmentally friendly, semi-aqueous, ultra-sonic cleaning
* Full desoldering and rework (SMT and leaded)
* Microscopy inspection (Standard on fine pitch)
* Procurement as required
* Problem solving and technical back-up, where required
* Functional test